Mechanical Data – Silica & Buffer Materials

Mechanical Data of Fused Silica

Density (g/cm 3 )	2.201
Mohs Hardness	5.5
Micro Hardness	5.5
Young’s Modulus (@ room temp	71.0 GPa
Poisson’s Ratio (@ room temp.)	0.14
Tensile Strength	5.0 X 10 7 N/m 2
Torisional Strength	3.0 X 10 7 N/m 2
Bending Strength	6.0 X 10 7 N/m 2
Torisional Modulus	3.1 X 10 10 N/m 2

Cured Film Properties of Polyimide

Tensile Strength (kg/mm 2 )	13.1
Elongation (%)	10
Modulus (kg/mm 2 )	245
Stress (dynes/cm 2 )	2 – 3
Moisture Uptake (%)	0.14
Dielectric Constant (at 1 kHz, 50% RH)	3.3
Dissipation Factor	0.002
Dielectric Strength (volts/mil)	4000
Volume Resistivity (ohm-cm)	10 16
Surface Resistivity (ohm	10 15
Coefficient of Thermal Expansion (ppm	40
Coefficient of Thermal Conductivity (cal/(cm)(sec)(°C)	35 x 10 -5
Glass Transition Temperature	>320°C
Decomposition Temperature	560°C
Weight Loss (% at 500°C, 120 min)	2.9
Specific Heat (cal/g/°C)	0.26
Refractive Index	1.70

Selected Properties of Acrylate

Tensile Strength (kg/mm 2 )	2.9
Elongation (%)	70
Elastic Modulus (kg/mm 2 )	17.34
Secant Modulus (kg/mm ² ) at 23°C	50
Thermal Conductivity (MPa)
Coefficient of Expansion (mm/(mm x °C) in the glassy region	50
Maximum Safe Operating Temperature (deg C)	85
Refractive Index	1.54

Note: Uncured material is basically a polydimethylsiloxane (PDMS) resin and a curing agent of similar chemical make-up with proprietary ingredients. No MSDS is being provided by the manufacturer; however it does not have any ingredients that would require hazard warning under the OSHA HAZARD COMMUNICATION STANDARD.

Selected Properties of Tefzel®

Flexural Modulus, psi (ASTM D790)	93,500
Tensile Strength, psi (ASTM D1708)
@ 23°C (73°F)	5,500
@ 140°C (284°F)	1,650
@ 160°C (320°F)	1,250
@ 180°C (356°F)	900
@ 200°C (392°F)	500
Elongation, % (ASTM D1708)
@! 23°C (73°F)	300
@ 140°C (284°F)	600
@ 160°C (320°F)	650
@ 180°C (356°F)	600
@ 200°C (392°F)	600
Specific Gravity (ASTM D792).	1.75-1.79
MIT Flex Life	120,000

Selected Properties of Nylon

Tensile E-Modulus, MPa, 1 mm/min (ISO 527)	1100
Tensile strength at yield, MPa, 50 mm/min (ISO 527)	40
Elongation at yield, (%), 50 mm/min (ISO 527)	12
Tensile strength at break, MPa, 50 mm/min (ISO 527)	50
Elongation at break, (%), 50 mm/min (ISO 527)	> 50
Impact strength, (kJ/m²)	Charpy
@ 23°C (ISO 179/2-1eU)	no break
@ -30°C (ISO 179/2-1eU)	no break
Notched impact strength (kJ/m²)	Charpy
@ 23°C (ISO 179/2-1eA)	10
@ -30°C (ISO 179/2-1eA)	7
Ball indentation hardness, MPa, (ISO 2039-1)	70

Selected Properties of Hard Clad Coating

Refractive Index @ 633 nm	1.415 ± 0.005
@ 852 nm	1.409 ± 0.005
Dynamic Mechanical Analysis
Max. Tan ? temperature	94.9 ºC
Secant Modulus
@ 2.5 % Strain	104.46 ± 10 kgf/mm 2
Tensile Strength at Break	4.41 ± 0.5 kgf/mm 2
Elongation at Break	22.98 ± 10 %

Cured Film Properties of Silicone

Tensile Strength (kg/mm ² )	1.415 ± 0.005
Elongation (%)	1.409 ± 0.005
Hardness , Shore A (JIS)	. 4
Young’s Modulus…(kg/mm ² )	120
Thermal Conductivity (W/cm.K)	20
@ 2.5 % Strain	0.23
Maximum Safe Operating Temperature ( deg C)	200
Refractive Index	1.41

Note: Uncured material is basically a polydimethylsiloxane (PDMS) resin and a curing agent of similar chemical make-up with proprietary ingredients. No MSDS is being provided by the manufacturer, however it does not have any ingredients that would require hazard warning under the OSHA HAZARD COMMUNICATION STANDARD.

Selected Properties of Aluminum (99.999% Minimum Purity)

Tensile Strength (dynes/cm 2 )	4.74 x 10 8
Elongation (%)	48.8
Young’s Modulus (dynes/cm 2 )	6.89 x 10 11
Poisson’s Ratio	0.33
Melting Point (°C)	660.3
Boiling Point (°C)	2519
Density @ 25°C (g/cm 3 )	2.70
Molten Density (g.cm 3 )	2.375
Electrical Resistivity @ 300 K (RT) (10 -8 ohm .m)	2.733
Heat Capacity (J/g.K)	0.897
Coefficient of Thermal Expansion @ 300 K (K -1 )	23.2 x 10 -6
Coefficient of Thermal Conductivity @ 273 K (W/cm.K)	2.38

Selected Properties of Gold (99.999% Minimum Purity)

Tensile Strength (dynes/cm 2 )	12.4 x 10 8
Elongation (%)	30
Young’s Modulus (dynes/cm 2 )	7.44 x 10 11
Poisson’s Ratio	0.42
Melting Point (°C)	1064.18
Boiling Point (°C)	2856
Density @ 25°C (g/cm 3 )	19.3
Molten Density (g.cm 3 )	17.31
Electrical Resistivity @ 300 K (RT) (10 -8 ohm .m)	2.271
Heat Capacity (J/g.K)	0.129
Coefficient of Thermal Expansion @ 300 K (K -1 )	14.1 x 10 -6
Coefficient of Thermal Conductivity @ 273 K (W/cm.K)	3.11